Evaporation systemSputtering system

Radiance cluster tool Radiance is a flexible tool with cluster architecture for substrate sizes up to 12 inch based around a central transport module with vacuum cassette elevator, robot and load lock.

evatec

Radiance Multi Process Platform

Radiance is a flexible tool with cluster architecture for substrate sizes up to 12 inch based around a central transport module with vacuum cassette elevator, robot and load lock. It can be equipped with Evatec’s single or multi process batch modules according to customer throughput and process requirements making it one of the most flexible tools available in the market for optics, semiconductor and optoelectronic applications. Choose from PVD, PECVD, ICP, RIE, Microwave, Soft Etch and RTP technologies  according to system configuration and expand your system as demands grow.

THE NEW GENERATION RADIANCE was launched at Semicon Europa in October 2010 with

New source technologies
New handling capabilities
New processes

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MSP Sputter tool IFrom colour wheel to 3D technology, the MSP offers cost effective sputter technology for high volume applications demanding repeatable, stable coatings.

evatec

High throughput batch squtter tool for precision optics

From colour wheel to 3D technology, the MSP offers cost effective sputter technology for high volume applications demanding repeatable, stable coatings.

Choose MSP technology for production of high end layers including edge & multiple bandpass filters, AR coatings and TCOs and

eliminate  test  runs when changing  between processes
achieve outstanding process repeatibilities even for non consecutive runs
achieve low temperature processing for sensitive substrate materials

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